| 특징 |
- 4~6" Wafer level technology
- Economical 1.8 microns per degree X-Y stage resolution
- Slide out 방식
- Hybrid Device에 적합한 Model 6000 series
- Fast microscope lift with lock |
| 장점 |
- Maximizes rigidity and minimizes vibration
- Minimizes set-up time
- Maximizes electrical contact to chuck surface |
| Applications |
- 8000 series의 chuck size 또는 resolution 이 요구되지 않는 곳
- Step & Repeat
- Where user requires fast load/unload of wafers
- Failure Analysis of production failures |
| 옵션 |
- Independent microscope lift
- Stainless steel vacuum chuck
- Motorized microscope X,Y,Z translation
- Probe card holder
- Thermal chuck system |
